1. 2. 3. material content data sheet sales product name tle6240gp issued 28. august 2013 ma# MA000693880 package pg-dso-36-48 weight* 2050.99 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 26.491 1.29 1.29 12916 12916 leadframe inorganic material phosphorus 7723-14-0 0.383 0.02 187 non noble metal zinc 7440-66-6 1.533 0.07 747 non noble metal iron 7439-89-6 30.652 1.49 14945 non noble metal copper 7440-50-8 1244.598 60.68 62.26 606827 622705 wire non noble metal copper 7440-50-8 2.573 0.13 0.13 1254 1254 encapsulation organic material carbon black 1333-86-4 1.423 0.07 694 plastics epoxy resin - 65.450 3.19 31911 inorganic material silicondioxide 60676-86-0 644.541 31.43 34.69 314258 346863 leadfinish non noble metal tin 7440-31-5 16.150 0.79 0.79 7874 7874 plating noble metal silver 7440-22-4 0.741 0.04 0.04 361 361 solder noble metal silver 7440-22-4 0.247 0.01 120 non noble metal tin 7440-31-5 0.165 0.01 80 non noble metal lead 7439-92-1 16.050 0.78 0.80 7826 8026 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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